Repair control circuit and semiconductor memory device including the same

ABSTRACT

A repair control circuit of controlling a repair operation of a semiconductor memory device includes a row matching block and a column matching block. The row matching block stores fail group information indicating one or more fail row groups among a plurality of row groups. The row groups are determined by grouping a plurality of row addresses corresponding to a plurality of wordlines. The row matching block generates a group match signal based on input row address and the fail group information, such that the group match signal indicates the fail row group including the input row address. The column matching block stores fail column addresses of the fail memory cells, and generates a repair control signal based on input column address, the group match signal and the fail column addresses, such that the repair control signal indicates whether the repair operation is executed or not.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority under 35 U.S.C. §119 to U.S.Provisional Application No. 61/728,911 filed on Nov. 21, 2012 in theUSPTO, and Korean Patent Application No. 10-2013-0023938, filed on Mar.6, 2013 in the Korean Intellectual Property Office, and entitled:“Repair Control Circuit and Semiconductor Memory Device Including theSame,” which is incorporated herein by reference in its entirety.

BACKGROUND

1. Field

Example embodiments relate generally to semiconductor integratedcircuits and more particularly to a repair control circuit and asemiconductor memory device including the repair control circuit forreplacing fail memory cells with redundancy memory cells in thesemiconductor memory device.

2. Description of the Related Art

Semiconductor memory devices include a plurality of memory cells thatare arranged in a matrix form of a plurality of rows and a plurality ofcolumns. The rows may correspond to wordlines to which respective rowaddresses are assigned and the columns may correspond to bitlines towhich respective column addresses are assigned. The semiconductor memorydevices may include normal memory cells and redundancy memory cells forreplacing fail memory cells among the normal memory cells. In theconventional memory device, a row repair operation may be performed toreplace one wordline with one redundancy wordline or a column repairoperation may be performed to replace one bitline with one redundancybitline.

As the integration density of the semiconductor memory device isincreased, single-bit fail rate is increased. When the single-bit failis dominant, the row-by-row repair and the column-by-column repair areinefficient because repair resources may be exhausted excessively andthus the integration density may be degraded. In case of implementingthe bit-by-bit repair, the size or the occupation area of the peripheralcircuitry is increased significantly to control the bit-by-bit repairoperation.

SUMMARY

At least one example embodiment of the inventive concept provides arepair control circuit, capable of efficiently controlling a repairoperation for single-bit fail.

At least one example embodiment of the inventive concept provides asemiconductor memory device, capable of performing the repair operationfor single-bit fail using the repair control circuit.

According to an example embodiment of the inventive concept, a repaircontrol circuit controlling a repair operation of a semiconductor memorydevice includes a row matching block and a column matching block. Therow matching block stores fail group information indicating one or morefail row groups among a plurality of row groups, where the row groupsare determined by grouping a plurality of row addresses corresponding toa plurality of wordlines, and each of the fail row groups includes oneor more fail row addresses of fail memory cells. The row matching blockgenerates a group match signal based on input row address and the failgroup information, such that the group match signal indicates the failrow group including the input row address. The column matching blockstores fail column addresses of the fail memory cells, and generates arepair control signal based on input column address, the group matchsignal and the fail column addresses, such that the repair controlsignal indicates whether the repair operation is executed or not.

The row matching block may store fail group addresses as the fail groupinformation. The fail group addresses may indicate the fail row groups,and a bit number of each fail group address may be smaller than a bitnumber of each fail row address.

The fail group addresses may be hashing values that are converted fromthe fail row addresses using a hashing function.

The fail group addresses may be determined by grouping remainders of thefail row addresses when divided by a reference value. A memory cellarray of the semiconductor memory device may include a plurality of subarrays, and the reference value may correspond to a number of wordlinesin each sub array.

A wordline number of a first row group corresponding to an edge portionof each sub array may be smaller than a wordline number of a second rowgroup corresponding to a center portion of each sub array.

The row matching block may include a group address storage configured tostore the fail group addresses, an address convertor configured toconvert the input row address to an input group address indicating therow group including the input row address, and a group comparatorconfigured to compare the input group address with the fail groupaddresses to generate the group match signal.

The row matching block may store group bits as the fail groupinformation. The group bits may respectively correspond to the rowgroups. Each group bit may have a first logic value when thecorresponding row group is the fail row group and a second logic valuewhen the corresponding row group is not the fail row group.

The row matching block may include a bloom filter table configured tostore the group bits, an address convertor configured to convert theinput row address to an input group address indicating the row groupincluding the input row address, and a signal generator configured toextract the logic value of the group bit corresponding to the inputgroup address from the bloom filter table to generate the group matchsignal.

The column matching block may include a column address storageconfigured to store the fail column addresses, and configured to outputthe fail column addresses corresponding to the fail row group includingthe input row address in response to the group match signal, and acolumn comparator configured to compare the input column address withthe fail column addresses output from the column address storage togenerate the repair control signal.

The column address storage may include a plurality of storage units forstoring the one or more fail column addresses with respect to each failrow group. The repair control signal may include a plurality of bitsignals indicating a column address of the redundancy memory cell forreplacing the fail memory cell corresponding to the input row addressand the input column address, and indicating whether the repairoperation is executed or not.

According to an example embodiment of the inventive concept, asemiconductor memory device includes a memory cell array, a rowselection circuit, a column selection circuit and a repair controlcircuit

The memory cell array includes a plurality of memory cells coupled to aplurality of wordlines and a plurality of normal bitlines, respectively,and a plurality of redundancy memory cells coupled to the plurality ofwordlines and a plurality of redundancy bitlines. The row selectioncircuit selects one of the wordlines based on input row address. Thecolumn selection circuit selects one of the normal bitlines based on aninput column address in a normal operation and selects one of theredundancy bitlines based on a repair control signal in a repairoperation. The repair control circuit stores fail group information andfail column addresses of fail memory cells. The fail group informationindicates one or more fail row groups among a plurality of row groups,and the row groups is determined by grouping a plurality of rowaddresses corresponding to the plurality of wordlines. Each of the failrow groups includes one or more fail row addresses of the fail memorycells. The repair control circuit generates the repair control signalbased on the input row address, the input column address, the fail groupinformation and the fail column addresses.

The repair control circuit may include a row matching block configuredto store the fail group information and configured to generate a groupmatch signal based on the input row address and the fail groupinformation, the group match signal indicating whether the row groupincluding the input row address is the fail row group or not, and acolumn matching block configured to store the fail column addresses andconfigured to generate the repair control signal based on the inputcolumn address, the group match signal and the fail column addresses,the repair control signal indicating whether the repair operation isexecuted or not.

The row matching unit may include a group address storage configured tostore fail group addresses as the fail group information, the fail groupaddresses indicating the fail row groups, a bit number of each failgroup address being smaller than a bit number of each fail row address.

The row matching block may include a bloom filter table configured tostore group bits as the fail group information, the group bitsrespectively corresponding to the row groups, each group bit having afirst logic value when the corresponding row group is the fail row groupand a second logic value when the corresponding row group is not thefail row group.

The row matching may block include an address convertor configured toconvert the input row address to an input group address indicating therow group including the input row address.

The semiconductor memory device may further include a non-volatilememory configured to store the fail group information and the failcolumn addresses. The fail group information and the fail columnaddresses in the non-volatile memory may be loaded to a volatile memoryincluded in the repair control circuit during an initializing process ofthe semiconductor memory device.

First memory cells and second memory cells may be replaced with theredundancy memory cells coupled to the same redundancy bitline, wherethe first memory cells and second memory cells are coupled to thedifferent normal bitlines and included in the different row groups.

According to an example embodiment of the inventive concept, a repaircontrol circuit controlling a repair operation of a semiconductor memorydevice includes a memory configured to store fail group information andfail column addresses of fail memory cells, the fail group informationindicating one or more fail row groups among a plurality of row groups,an address convertor configured to group a plurality of row addressescorresponding to a plurality of wordlines into the plurality of rowgroups, each of the fail row groups including one or more fail rowaddresses of the fail memory cells, and a comparison unit configured togenerate the repair control signal based on an input row address, aninput column address, the fail group information, and the fail columnaddresses.

The fail group addresses may be determined by grouping remainders of thefail row addresses when divided by a reference value, a memory cellarray of the semiconductor memory device including a plurality of subarrays, the reference value corresponding to a number of wordlines ineach sub array.

A number of wordlines in a first row group at an edge portion of eachsub array may be smaller than a number of wordlines of a second rowgroup at a center portion of each sub array.

BRIEF DESCRIPTION OF THE DRAWINGS

Example embodiments of the inventive concept will be more clearlyunderstood from the following detailed description taken in conjunctionwith the accompanying drawings.

FIG. 1 illustrates a block diagram of a semiconductor memory deviceincluding a repair control circuit according to an example embodiment ofthe inventive concept.

FIG. 2 illustrates a flow chart of a method of controlling a repairoperation in a semiconductor memory device according to an exampleembodiment of the inventive concept.

FIG. 3 illustrates a diagram of a method of determining row groupsaccording to an example embodiment of the inventive concept.

FIG. 4 illustrates a diagram of a method of storing fail groupinformation based on the row groups in FIG. 3 according to an exampleembodiment of the inventive concept.

FIG. 5 illustrates a diagram of a row matching block in the repaircontrol circuit in FIG. 1 according to an example embodiment of theinventive concept.

FIG. 6 illustrates a diagram of a column matching block in the repaircontrol circuit in FIG. 1 according to an example embodiment of theinventive concept.

FIG. 7 illustrates a diagram of a column selection circuit in thesemiconductor memory device of FIG. 1 according to an example embodimentof the inventive concept.

FIG. 8 illustrates a diagram for describing a group-by group repairoperation according to an example embodiment of the inventive concept.

FIG. 9 illustrates a diagram of an example layout of a memory cell arrayin the semiconductor memory device of FIG. 1.

FIG. 10 illustrates a diagram of a method of determining row groupsaccording to an example embodiment of the inventive concept.

FIG. 11 illustrates a diagram of a fail bit count distribution dependingon wordline positions.

FIG. 12 illustrates a diagram of a method of determining row groupsaccording to an example embodiment of the inventive concept.

FIG. 13 illustrates a diagram of a row matching block in the repaircontrol circuit in FIG. 1 according to an example embodiment of theinventive concept.

FIGS. 14 and 15 illustrates diagrams of a memory system according toexample embodiments of the inventive concept.

FIG. 16 illustrates a block diagram of a mobile system according to anexample embodiment.

FIG. 17 illustrates a block diagram of a computing system according toan example embodiment.

DETAILED DESCRIPTION

The inventive concept will be described more fully hereinafter withreference to the accompanying drawings, in which some exampleembodiments of the inventive concept are shown. The inventive conceptmay, however, be embodied in many different forms and should not beconstrued as limited to the example embodiments set forth herein. In thedrawings, the sizes and relative sizes of layers and regions may beexaggerated for clarity. Like numerals refer to like elementsthroughout.

It will be understood that when an element is referred to as being“connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent. As used herein, the singular forms “a,” “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise.

It should also be noted that in some alternative implementations, thefunctions/acts noted in the blocks of a method may occur out of theorder noted in the illustrated flowcharts (e.g., see FIG. 2). Forexample, two blocks shown in succession may in fact be executedsubstantially concurrently or the blocks may sometimes be executed inthe reverse order, depending upon the functionality/acts involved.

FIG. 1 illustrates a block diagram of a semiconductor memory deviceincluding a repair control circuit according to an example embodiment ofthe inventive concept. Referring to FIG. 1, a semiconductor memorydevice 1000 may include a memory cell array 100, a row selection circuit(RSEL) 200, a column selection circuit (CSEL) 300, and a repair controlcircuit 400.

The memory cell array 100 includes a plurality of memory cells MCscoupled to a plurality of wordlines WL0˜WLm and a plurality of normalbitlines BL0˜BLn, respectively, and a plurality of redundancy memorycells RCs coupled to the plurality of wordlines WL0˜WLm and a pluralityof redundancy bitlines RBL0 and RBL1. The memory cells MCs and theredundancy memory cells RCs share the wordlines WL0˜WLm to be accessedusing the common row addresses, respectively. FIG. 1 illustrates the tworedundancy bitlines for convenience of illustration, the number of theredundancy bitlines may be varied.

The row selection circuit 200 selects one of the wordlines WL0˜WLm basedon input row address IRADD. The row selection circuit 200 may include arow decoder, a wordline driver circuit, etc. The column selectioncircuit 300 selects one of the normal bitlines BL0˜BLn based on an inputcolumn address ICADD in a normal operation and selects one of theredundancy bitlines RBL0 and RBL1 based on a repair control signal RCTRin a repair operation. The column selection circuit 300 may include agating circuit, a column decoder, etc. As will be described withreference to FIG. 7, the repair control signal RCTR may indicate whetherthe repair operation has to be executed or not. In other words, therepair control signal RCTR may selectively indicate normal operation orrepair operation.

The repair control circuit 400 stores fail group information FGI andfail column addresses FCA of fail memory cells. The fail groupinformation FGI indicates one or more fail row groups among a pluralityof row groups, where the row groups are determined by grouping aplurality of row addresses corresponding to the plurality of wordlinesWL0˜WLm. Each of the fail row groups includes one or more fail rowaddresses of the fail memory cells. The repair control circuit 400generates the repair control signal RCTR based on the input row addressIRADD, the input column address ICADD, the fail group information FGI,and the fail column addresses FCA.

As illustrated in FIG. 1, the repair control circuit 400 may include arow matching block 600 and a column matching block 600. The row matchingblock 500 stores the fail group information FGI and generates a groupmatch signal GMAT based on the input row address IRADD and the storedfail group information FGI such that the group match signal GMAT mayindicate whether the row group including the input row address IRADD isthe fail row group or not. The column matching block 600 stores the failcolumn addresses FCA and generates the repair control signal RCTR basedon the input column address ICADD, the group match signal GMAT, and thestored fail column addresses FCA, such that the repair control signalRCTR indicates whether the repair operation has to be executed or not.

In an example embodiment, as illustrated in FIG. 1, the semiconductormemory device 1000 may further include a non-volatile memory (NVM) 700.The non-volatile memory 700 stores the fail group information FGI andthe fail column addresses FCA. Through a testing process using anexternal tester, address information on the fail memory cells in thememory cell array 100 may be detected and the results may be written inthe non-volatile memory 700 in the form of the fail group informationFGI and the fail column addresses FCA. As described below with referenceto FIGS. 3 and 4, the fail row addressed of the fail memory cells areconverted to the fail group addresses or the group bits. The fail groupinformation FGI and the fail column addresses FCA in the non-volatilememory 700 may be loaded to a volatile memory included in the repaircontrol circuit 400 during an initializing process of the semiconductormemory device 1000.

In an example embodiment, the semiconductor memory device 1000 mayinclude a built-in self test (BIST) circuitry, and the fail groupinformation FGI and the fail column addresses FCA may be provided to therepair control circuit 400 through a testing process using the BISTcircuit. In this case, the non-volatile memory 700 may be omitted.

When the conventional memory device includes the repair resources suchas the redundancy memory cells RCs and the redundancy bitlines RBL0 andRBL1 in FIG. 1, the conventional memory device performs column-by-columnrepair operation. Even though only one memory cell is failed amongmemory cells coupled to one normal bitline, the other good cells have tobe replaced with the redundancy memory cells. Accordingly, suchcolumn-by-column repair is inefficient because repair resources may beexhausted excessively. Many redundancy bitlines are required to performthe column-by-column repair and, thus, the integration density may bedegraded. In case of implementing a bit-by-bit repair, the size or theoccupation area of the repair control circuit 400 for determiningwhether the accessed memory cell is the fail memory cell is increasedsignificantly. Thus, the integration rate of the semiconductor memorydevice 1000 is degraded.

According to example embodiments of the inventive concept, the rowaddresses of the wordlines are grouped into row groups and agroup-by-group repair operation is performed to use the repair resourcesefficiently. Thus, the size or the occupation area of the repair controlcircuit 400 and the semiconductor memory device 1000 may be reduced.

FIG. 2 illustrates a flow chart of a method of controlling a repairoperation in a semiconductor memory device according to an exampleembodiment of the inventive concept. Referring to FIGS. 1 and 2, the rowaddresses of wordlines are grouped into the row groups (S100). Thegrouping method may be determined according to the operational scenarioof the semiconductor memory device 1000, and the format of the failgroup information FGI and the configuration of the repair controlcircuit 400 may be determined according to the grouping method.

The repair control circuit 400 stores the fail group information FGI andthe fail column addresses FCA (S300). As described above, the fail groupinformation FGI and the fail column addresses FCA may be stored inadvance in the non-volatile memory 700 to be retained even during thepower-off state. The initialization process is performed when thesemiconductor memory device 1000 is powered, and the fail groupinformation FGI and the fail column addresses FCA may be loaded to therepair control circuit 400 from the non-volatile memory 700 forimplementing the rapid repair operation.

The repair control circuit 400 generates the repair control signal RCTRby comparing the input row address IRADD and input column address ICADDwith the stored fail group information FGI and fail column addresses FCA(S500). The grouping method and the generation of the repair controlsignal RCTR are described below with reference to FIGS. 3 through 13.

The row and column selection circuits 200 and 300 select the memory cellMC or the redundancy memory cell RC based on the input row addressIRADD, the input column address ICADD, and the repair control signalRCTR. In the normal operation to access the good memory cell, the rowselection circuit 200 selects or enables the one wordline correspondingto the input row address IRADD and the column selection circuit 300selects the one normal bitline corresponding to the input column addressICADD. The write operation or the read operation is performed withrespect to the accessed memory cell that is coupled to the selectedwordline and the selected normal bitline. In the repair operation toaccess the fail memory cell, the column selection circuit 300 selectsthe one redundancy bitline corresponding to the repair control signalRCTR instead of the normal bitline and, thus, the fail memory cellcoupled to the normal bitline is replaced with the redundancy memorycell coupled to the redundancy bitline.

Hereinafter, the configuration and the operation of the repair controlcircuit 400 and the semiconductor memory device 1000 are described indetail referring to the example embodiments of FIGS. 3 through 13.

FIG. 3 illustrates a diagram of a method of determining row groupsaccording to an example embodiment of the inventive concept. In anexample embodiment, the above-mentioned row groups may be determinedusing a hashing function. The 8-bit row addresses of the wordlines and4-bit group addresses of the row groups are illustrated in FIG. 3 forconvenience of description, the bit number of each row address, thenumber of the row groups and the bit-number of each group address may bevaried.

Referring to FIG. 3, the grouping method using the hashing function maybe represented by a hashing logic 50. For example, the hashing logic 50may include a plurality of exclusive OR (XOR) logic gates 51, 52, 53,and 54. The XOR logic gates 51, 52, 53, and 54 perform the XOR logicoperations on the respective four bits among the eight bits of each rowaddress to provide the four bits of each group address. As a result,each 8-bit row address is converted to each 4-bit group address, andthus the 2⁸ (=512) row addresses from (00000000) to (11111111) aregrouped into 2⁴ row groups corresponding to the 2⁴ group addresses from(0000) to (1111).

Even though FIG. 3 illustrates an example hashing logic including theXOR logic gates 51, 52, 53 and 54, the hashing logic may be determinedvariously according to the scenario of the semiconductor memory device1000. For example, a mid-square function, a division function, a foldingfunction, a radix function etc. or a combination thereof may be used asthe hashing function for determining the row groups.

FIG. 4 illustrates a diagram of a method of storing fail groupinformation based on the row groups in FIG. 3 according to an exampleembodiment of the inventive concept. FIG. 4 illustrates the five failrow addresses of the fail memory cells as an example, the fail groupaddresses converted from the fail row addresses to indicate the fail rowgroups and the bloom filter table in which the group bits are mappedwith the group indices so that the logic values of the group bits mayindicate the fail row groups.

The fail group addresses may be hashing values that are converted fromthe fail row addresses using a hashing function, e.g., the hashing logic50 as illustrated in FIG. 3, and the bit number (e.g. four) of each failgroup address becomes smaller than the bit number (e.g., eight) of eachfail row address. The above mentioned fail group information FGI may bethe fail group addresses.

Also, the fail group information FGI may be represented by the bloomfilter table in which the group bits are mapped to the group indices sothat the group bits may respectively correspond to the row groups. Eachgroup bit may have a first logic value when the corresponding row groupis the fail row group and a second logic value when the correspondingrow group is not the fail row group. As illustrated in FIG. 4, the failgroup information FGI may be represented, such that the logic high value“1” is written in the group bits mapped to the group indices 2, 3, 5, 6,and 9 to indicate the fail row groups, and the logic low value “0” iswritten in the other group bits.

In an example embodiment, as described with reference to FIG. 5, the rowmatching block 500 in the repair control circuit 400 may store the failgroup addresses as the fail group information FGI. In another exampleembodiment, as described with reference to FIG. 13, the row matchingblock 500 in the repair control circuit 400 may store the group bitsmapped to the group indices as the fail group information FGI.

FIG. 5 illustrates a diagram illustrating a row matching block in therepair control circuit in FIG. 1 according to an example embodiment ofthe inventive concept. Referring to FIG. 5, the row matching block 500 amay include a group address storage 520, an address convertor 540, and agroup comparator 560.

The group address storage 520 stores the fail group addresses FGA0 andFGA1 having the smaller bits that the fail row addresses. The groupaddress storage 520 may include a plurality of storage units 521 and 522to store the respective fail group addresses FGA0 and FGA1. The numberof the storage units may be varied according to the structure of thememory cell array 100 in the semiconductor memory device 1000. Forexample, the number of the storage units may correspond to an entirenumber of row groups depending on the grouping method.

The address convertor 540 receives the input row address IRADD andconverts the input row address IRADD to an input group address IGADDindicating the row group including the input row address IRADD. Theaddress convertor 540 may have the same configuration as the hashinglogic 50 that performs the hashing function to convert the fail rowaddresses to the fail group addresses.

The group comparator 560 compares the input group address IGADD with thefail group addresses FGA0 and FGA1 to generate the group match signalGMAT. The group comparator 560 may include a plurality of comparisonunits 561 and 562 to compare the respective fail group addresses FGA0and FGA1 with the input group address IGADD. For example, the firstcomparison unit 561 may include a plurality of XOR logic gates 61 and anAND gate 62. The XOR logic gates 61 performs the bit-by-bit comparisonof the first fail group address FGA0 and the input group address IGADDand the AND logic gate 62 performs an AND logic operation on the outputsof the XOR logic gates 61 to generate the first bit signal GMAT[0] ofthe group match signal GMAT. The first bit signal GMAT[0] may beactivated to the logic high level when the first fail group address FGA0is equal to the input group address IGADD, and deactivated to the logiclow level when the first fail group address FGA0 is different from theinput group address IGADD. In the same way, the second comparison unit562, having the same configuration as the first comparison unit 561, maygenerate the second bit signal GMAT[1] of the group match signal GMAT,which is activated to the logic high level when the second fail groupaddress FGA1 is equal to the input group address IGADD, and deactivatedto the logic low level when the second fail group address FGA1 isdifferent from the input group address IGADD. The group match signalGMAT may include a plurality of the bit signals GMAT[0] and GMAT[1], andthe bit signals GMAT[0] and GMAT[1] may indicate the fail row groupincluding the input row address IRADD. One of the bit signals GMAT[0]and GMAT[1] is activated when the input row address IRADD belongs to oneof the fail row groups, and all of the bit signals GMAT[0] and GMAT[1]are deactivated when the input row address IRADD does not belong to anyof the fail row groups.

As such, by grouping the row addresses, storing the fail group addressesFGA0 and FGA1 of the smaller bit number instead of the fail rowaddresses, and comparing the fail group addresses FGA0 and FGA1 with theinput group address IGADD, the occupation area of the address storage520 for storing the fail cell information and the occupation area of thegroup comparator 560 may be reduced. The reduction of the occupationarea is significant as the integration rate and the cell numbers of thesemiconductor memory device 1000 are increased.

FIG. 6 illustrates a diagram of a column matching block in the repaircontrol circuit in FIG. 1 according to an example embodiment of theinventive concept. Referring to FIG. 6, the column matching block 600 amay include a column address storage 620 and a column comparator 640.

The column address storage 620 stores the fail column addresses FCA00,FCA01, FCA0q, FCAk0, FCAk1, and FCAkq. The column address storage 620may include a plurality of storage units 521, 522, 523, 524, 525, and526 to store the respective fail column addresses FCA00, FCA01, FCA0q,FCAk0, FCAk1, and FCAkq, respectively. The column address storage 620may output the fail column addresses corresponding to the fail row groupincluding the input row address IRADD in response to the group matchsignal GMAT[0]˜GMAT[k]. For example, the column address storage 620 mayselect the storage units 521, 522, and 523 in the first row to outputthe FCA00, FCA01, and FCA0q stored therein when the first bit signalGMAT[0] is activated, and the column address storage 620 may select thestorage units 524, 525, and 526 in the k-th row to output the FCAk0,FCAk1 and FCAkq stored therein when the k-th bit signal GMAT[0] isactivated. Depending on the distribution of the fail memory cells in thememory cell array 100 in FIG. 1, some of the storage units 521, 522,523, 524, 525, and 526 may be empty, e.g., may store default values.

The column comparator 640 compares the input column address ICADD withthe fail column addresses output from the column address storage 620 togenerate the repair control signal RCTR. The column comparator 640 mayinclude a plurality of comparison units 641, 642, and 643 to compare theinput column address ICADD with the respective fail column addresses.For example, the first comparison unit 641 may compare the input columnaddress ICADD with one of the fail column addresses FCA00 and FCAk0output from the first column of the column address storage 620. Thefirst comparison unit 641 may generate the first bit signal RCTR[0] ofthe repair control signal RCTR, which is activated to the logic highlevel when the input column address ICADD is equal to the fail groupaddress output from the first column of the column address storage 620and is deactivated to the logic low level when the input column addressICADD is different from the fail group address output from the firstcolumn of the column address storage 620. In the same way, the secondcomparison unit 642 may generate the second bit signal RCTR[1] of therepair control signal RCTR, which is activated when the input columnaddress ICADD is equal to the fail column address from the second columnof the column address storage 620, and so forth.

As such, the repair control signal RCTR may include a plurality of thebit signals RCTR[0], RCTR[1], and RCTR[q] that indicate whether theinput column address ICADD is equal to one of the stored fail columnaddresses of the fail row group including the input row address IRADD.One of the bit signals RCTR[0], RCTR[1], and RCTR[q] is activated whenthe input column address ICADD is equal to one of the fail columnaddresses output from the column address storage 620 and all of the bitsignals RCTR[0], RCTR[1], and RCTR[q] are deactivated when the inputcolumn address ICADD is not equal to any of the fail column addressesoutput from the column address storage 620.

The repair control signal RCTR including the plurality of the bitsignals RCTR[0], RCTR[1], and RCTR[q] may indicate, in addition towhether the repair operation is executed or not, a column address of theredundancy memory cell RC for replacing the fail memory cell MCcorresponding to the input row address IRADD and the input columnaddress ICADD. The repair control signal RCTR may indicate the normaloperation for accessing the memory cell MC when all of the bit signalsRCTR[0], RCTR[1], and RCTR[q] are deactivated, and may indicate therepair operation for replacing the memory cell MC with the redundancymemory cell RC when one of the bit signals RCTR[0], RCTR[1], and RCTR[q]is activated. As described below with reference to FIG. 7, the selectiveactivation of the bit signals RCTR[0], RCTR[1], and RCTR[q] may indicatethe column address of the redundancy memory cell RC, i.e., the oneredundancy bitline for the repair operation.

FIG. 7 illustrates a diagram of a column selection circuit in thesemiconductor memory device of FIG. 1 according to an example embodimentof the inventive concept. Referring to FIG. 7, the column selectioncircuit 300 a may include a normal column selection circuit (NCSEL) 310,a redundancy column selection circuit (RCSEL) 320, and a logic gate 330.

The logic gate 330 may generate a repair enable signal REN based on thebit signals in the repair control signals RCTR. For example, if one ofthe bit signals is activated to the logic high level, it indicates thatthe repair operation has to be executed, and, if all of the bit signalsare deactivated to the logic low level, it indicates that the repairoperation is not required. In this case, the logic gate 330 may beimplemented with an OR logic gate, such that the logic high level of therepair enable signal REN may indicate the repair operation and the logiclow level of the repair enable signal REN may indicate the normaloperation.

When the repair enable signal REN has the logic low level, theredundancy column selection circuit 320 is disabled and the normalcolumn selection circuit 310 is enabled to perform the normal operation.In the normal operation, one of the normal bitlines corresponding to theinput column address ICADD to access the memory cell MC. When the repairenable signal REN has the logic high level, the normal column selectioncircuit 310 is disabled and the redundancy column selection circuit 320is enabled to perform the repair operation. In the repair operation, oneof the redundancy bitlines corresponding to the repair control signalRCTR to access the redundancy memory cell RC instead of the memory cellMC.

FIG. 8 illustrates a diagram for describing a group-by group repairoperation according to an example embodiment of the inventive concept.As an example, FIG. 8 illustrates a first fail row group GROUPaincluding a first wordline WLa1 and a second wordline WLa2, and a secondfail row group GROUPb including a third wordline WLb1 and a fourthwordline WLb2. Depending on the grouping method, one or more wordlinesof the other row groups may exist between the first wordline WLa1 andthe second wordline WLa2 or between the third wordline WLb1 and thefourth wordline WLb2.

As described above, the repair control circuit 400 stores the first failgroup address corresponding to the first fail row group GROUPa and thethree fail column addresses corresponding to the normal bitlines BL0,BL2, and BL3 to which the fail memory cells A, C, D, and F are coupled.Also the repair control circuit 400 stores the second fail group addresscorresponding to the second fail row group GROUPb and the three failcolumn addresses corresponding to the normal bitlines BL1, BL3 and BL4to which the fail memory cells G, J and K are coupled.

The repair operation is performed group-by-group as follows.

In case of the repair operation for the first fail row group GROUPa, thefail memory cell A and the good memory cell B coupled to the firstnormal bitline BL0 are replaced with the redundancy memory cells coupledto the first redundancy bitline RBL0, because the row addresses of thefirst and second wordlines WLa1 and WLa2 are converted to the same firstfail group address. In the same way, the memory cells C and D coupled tothe third normal bitline BL2 are replaced with the redundancy memorycells coupled to the second redundancy bitline RBL1, and the memorycells E and F coupled to the fourth normal bitline BL3 are replaced withthe redundancy memory cells coupled to the third redundancy bitlineRBL2.

In case of the repair operation for the second fail row group GROUPb,the fail memory cell G and the good memory cell H coupled to the secondnormal bitline BL1 are replaced with the redundancy memory cells coupledto the first redundancy bitline RBL0, because the row addresses of thethird and fourth wordlines WLb1 and WLb2 are converted to the samesecond fail group address. In the same way, the memory cells I and Jcoupled to the fourth normal bitline BL3 are replaced with theredundancy memory cells coupled to the second redundancy bitline RBL1,and the memory cells K and L coupled to the fifth normal bitline BL4 arereplaced with the redundancy memory cells coupled to the thirdredundancy bitline RBL2.

As a result, first memory cells and second memory cells may be replacedwith the redundancy memory cells coupled to the same redundancy bitline,where the first memory cells and second memory cells are coupled to thedifferent normal bitlines and included in the different row groups. Forexample, the redundancy memory cells of the first redundancy bitlineRBL0 may replace the first memory cells A and B of the first normalbitline BL0 and the first fail row group GROUPa and the second memorycells G and H of the second normal bitline BL1 and the second fail rowgroup GROUPb.

Through such group-by-group repair operation, the repair resources maybe used efficiently and thus the integration rate of the semiconductormemory device may be enhanced.

FIG. 9 illustrates a diagram of an example layout of a memory cell arrayin the semiconductor memory device of FIG. 1. Referring to FIG. 9, thememory cell array 100 a may include a plurality of sub arrays 101, 102,and 103, and the bitline sense amplifier circuits BLSAs may be disposedbetween the sub arrays 101, 102, and 103.

The sub arrays 101, 102, and 103 may each include the same number ofwordlines. For example, each of the sub arrays 101, 102, and 103 mayinclude 512 wordlines as illustrated in FIG. 9. In such a layout of thememory cell array 100 a, the wordlines disposed in the same portion ofthe respective sub arrays 101, 102, and 103 may have the samecharacteristics. In this case, the above-mentioned row groups may bedetermined by grouping the remainder of the row addresses when dividedby a reference value, wherein the reference value may correspond to thenumber of the wordlines in each sub array.

FIG. 10 illustrates a diagram of a method of determining row groupsaccording to an example embodiment of the inventive concept.

Referring to FIG. 10, the row groups may be determined by uniformlygrouping the remainders of the row addresses when divided by thereference value (e.g., 512). Each row group includes 64 row addresses of64 wordlines and, thus, the 512 row addresses may be grouped into eightrow groups represented by the group indices 0 to 7. FIG. 10 illustratesan example of the group addresses indicating the first row group (groupindex 0) to the eighth row group (group index 7) and the group bits.Referring to the example logic values of the group bits, the third rowgroup (group index 2), the fourth row group (group index 3), the sixthrow group (group index 5), and the seventh row group (group index 6)correspond to the fail row groups. As described above, the fail groupaddresses (010, 011, 101, 110) may be stored as the fail groupinformation FGI or the group bits mapped to the group indices may bestored in the bloom filter table as the fail group information FGI.

FIG. 11 illustrates a diagram of a fail bit count distribution dependingon wordline positions. FIG. 12 is a diagram illustrating a method ofdetermining row groups according to an example embodiment of theinventive concept.

Referring to FIG. 11, the fail bit count, i.e., the number of the failmemory cells in a wordline may increase for wordlines disposed near theedge portions. In other words, the wordlines WL0 and WL511 in theboundary of the sub array may have more fail memory cells associatedtherewith than remaining wordlines. In this case, the row groups may bedetermined as illustrated in FIG. 12, such that a number of wordlines ofa first row group corresponding to an edge portion of each sub array issmaller than a number of wordlines of a second row group closer to acenter portion of each sub array. For example, remaining wordlines maybe grouped such that each of the row groups (group indices 0, 1, 2, 5, 6and 7) near the upper and bottom edge portions of the sub array mayinclude one wordline and each of the row groups (group indices 3 and 4)near the center portion of the sub array may include 253 wordlines. Assuch, by assigning mroe repair resources to the row groups having higherprobability of the fail memory cells, the repair resources may bedistributed efficiently.

FIG. 13 illustrates a diagram of a row matching block in the repaircontrol circuit in FIG. 1 according to an example embodiment of theinventive concept. FIG. 13 illustrates a row matching block 500 b havinga configuration of a bloom filter. Referring to FIG. 13, the rowmatching block 500 b may include an address convertor 540, a bloomfilter table 570, and a signal generator 590.

The bloom filter table 570 stores the group bits that are mapped to thegroup indices indicating the corresponding row groups as described withreference to FIG. 4. The fail group information FGI may be represented,such that the first logic value (e.g., the logic high value “1”) iswritten in the group bits mapped to the group indices 0, 3, 4, 6 and 7to indicate the fail row groups and the second logic value (e.g., thelogic low value “0”) is written in the other group bits mapped to thegroup indices 1, 2 and 5.

The address convertor 540 converts the input row address IRADD to aninput group address IGADD indicating the row group including the inputrow address IRADD. The bit number M of the input group address IGADD issmaller than the bit number N of the input row address.

The signal generator 590 extracts the logic value of the group bitcorresponding to the input group address IGADD from the bloom filtertable 570 to generate the group match signal GMAT. For example, thebloom filter table 570 may generate a hit signal HTB that is activatedwhen the logic value of the group bit corresponding to the input groupaddress IGADD indicates the fail row block. The group match signal GMATmay include the plurality of bit signals GMAT[0] to GMAT[k] to indicatethe fail row group including the input row address IRADD. When the hitsignal HTB is activated, the signal generator 590 may activate the onebit signal corresponding to the input group address IGADD among the bitsignals GMAT[0] to GMAT[k] in response to the input group address IGADD.

As such, by grouping the row addresses and storing and using the groupbits as the fail group information FGI, efficient repair operation maybe implemented and the integration rate and yield of the memory devicemay be enhanced.

FIGS. 14 and 15 illustrate diagrams of a memory system according toexample embodiments of the inventive concept.

Referring to FIG. 14, a memory system 10 may include a memory controller11 and a semiconductor memory device 12. Based on the address ADD andthe command CMD, the semiconductor memory device 12 may perform the readoperation or the write operation to transfer the read data and the writedata with the memory controller 11.

Different from the repair control circuit 400 in the semiconductormemory device 1000 of FIG. 1, the repair control circuit RCC 400 may beincluded in the memory controller 11 as illustrated in FIG. 14. In thiscase, the memory controller 11 may access the redundancy memory cells inthe semiconductor memory device 12 using the repair control signal RCTR.

Referring to FIG. 15, a memory system 20 may include a memory controller21 and a memory module 22. The memory module 22 may include a pluralityof memory chips (MEM) 23 and a module hub 24 or a buffer chip to controlthe access to the memory chips 23.

Different from the above described embodiments, the repair controlcircuit RCC 400 may be included in the module hub 24 as illustrated inFIG. 15. In this case, the memory controller 21 and/or the module hub 24may access the redundancy memory cells in the memory chips 23 using therepair control signal RCTR.

FIG. 16 illustrates a block diagram of a mobile system according to anexample embodiment. Referring to FIG. 16, a mobile system 1100 includesan application processor 1110, a connectivity unit 1120, a memory device1150, a nonvolatile memory device 1140, a user interface 1130, and apower supply 1160. In some embodiments, the mobile system 1100 may be amobile phone, a smart phone, a personal digital assistant (PDA), aportable multimedia player (PMP), a digital camera, a music player, aportable game console, a navigation system, etc.

The application processor 1110 may execute applications, such as a webbrowser, a game application, a video player, etc. In some embodiments,the application processor 1110 may include a single core or multiplecores. For example, the application processor 1110 may be a multi-coreprocessor, such as a dual-core processor, a quad-core processor, ahexa-core processor, etc. The application processor 1110 may include aninternal or external cache memory.

The connectivity unit 1120 may perform wired or wireless communicationwith an external device. For example, the connectivity unit 1120 mayperform Ethernet communication, near field communication (NFC), radiofrequency identification (RFID) communication, mobile telecommunication,memory card communication, universal serial bus (USB) communication,etc. In some embodiments, the connectivity unit 1120 may include abaseband chipset that supports communications, such as global system formobile communications (GSM), general packet radio service (GPRS),wideband code division multiple access (WCDMA), high speeddownlink/uplink packet access (HSxPA), etc.

The memory device 1150 may store data processed by the applicationprocessor 1110 or may operate as a working memory. According to exampleembodiments, the memory device 1150 includes the repair control circuit(RCC) 400. The repair control circuit 400 may include the row matchingblock 500 and the column matching block 600 as described with referenceto FIG. 1. The row matching block 500 stores the fail group informationFGI and generates a group match signal GMAT based on the input rowaddress IRADD and the stored fail group information FGI such that thegroup match signal GMAT may indicate whether the row group including theinput row address IRADD is the fail row group or not. The columnmatching block 600 stores the fail column addresses FCA and generatesthe repair control signal RCTR based on the input column address ICADD,the group match signal GMAT, and the stored fail column addresses FCAsuch that the repair control signal RCTR may indicate whether the repairoperation has to be executed or not.

For example, the memory device 1150 may be a dynamic random accessmemory, such as DDR SDRAM, LPDDR SDRAM, GDDR SDRAM, RDRAM, etc., or maybe any volatile memory device that requires the repair operation. Thenonvolatile memory device 1140 may store a boot code for booting themobile system 1100. For example, the nonvolatile memory device 1140 maybe an electrically erasable programmable read-only memory (EEPROM), aflash memory, a phase change random access memory (PRAM), a resistancerandom access memory (RRAM), a nano floating gate memory (NFGM), apolymer random access memory (PoRAM), a magnetic random access memory(MRAM), a ferroelectric random access memory (FRAM), etc.

The user interface 1130 may include at least one input device, such as akeypad, a touch screen, etc., and at least one output device, such as aspeaker, a display device, etc. The power supply 1160 may supply a powersupply voltage to the mobile system 1100. In some embodiments, themobile system 1100 may further include a camera image processor (CIS),and/or a storage device, such as a memory card, a solid state drive(SSD), a hard disk drive (HDD), a CD-ROM, etc.

In some embodiments, the mobile system 1100 and/or components of themobile system 1100 may be packaged in various forms, such as package onpackage (PoP), ball grid arrays (BGAs), chip scale packages (CSPs),plastic leaded chip carrier (PLCC), plastic dual in-line package (PDIP),die in waffle pack, die in wafer form, chip on board (COB), ceramic dualin-line package (CERDIP), plastic metric quad flat pack (MQFP), thinquad flat pack (TQFP), small outline IC (SOIC), shrink small outlinepackage (SSOP), thin small outline package (TSOP), system in package(SIP), multi chip package (MCP), wafer-level fabricated package (WFP),or wafer-level processed stack package (WSP).

FIG. 17 illustrates a block diagram of a computing system according toan example embodiment. Referring to FIG. 17, a computing system 1200includes a processor 1210, an input/output hub (IOH) 1220, aninput/output controller hub (ICH) 1230, at least one memory module 1240,and a graphics card 1250. In some embodiments, the computing system 1200may be a personal computer (PC), a server computer, a workstation, alaptop computer, a mobile phone, a smart phone, a personal digitalassistant (PDA), a portable multimedia player (PMP), a digital camera),a digital television, a set-top box, a music player, a portable gameconsole, a navigation system, etc.

The processor 1210 may performing various computing functions, such asexecuting specific software for performing specific calculations ortasks. For example, the processor 1210 may be a microprocessor, acentral process unit (CPU), a digital signal processor, or the like. Insome embodiments, the processor 1210 may include a single core ormultiple cores. For example, the processor 1210 may be a multi-coreprocessor, such as a dual-core processor, a quad-core processor, ahexa-core processor, etc. Although FIG. 17 illustrates the computingsystem 1200 including one processor 1210, in some embodiments, thecomputing system 1200 may include a plurality of processors. Theprocessor 1210 may include an internal or external cache memory.

The processor 1210 may include a memory controller 1211 for controllingoperations of the memory module 1240. The memory controller 1211included in the processor 1210 may be referred to as an integratedmemory controller (IMC). A memory interface between the memorycontroller 1211 and the memory module 1240 may be implemented with asingle channel including a plurality of signal lines, or may beimplemented with multiple channels, to each of which at least one memorymodule 1240 may be coupled. In some embodiments, the memory controller1211 may be located inside the input/output hub 1220, which may bereferred to as memory controller hub (MCH).

The memory module 1240 may include a plurality of memory devices thatstore data provided from the memory controller 1211. The repair controlcircuit according to example embodiments may be included in the memorycontroller 1211 or a buffer chip in the memory module 1240. In someexample embodiments, a plurality of repair control circuits may beincluded respectively in the memory chips in the memory module 1240.

The input/output hub 1220 may manage data transfer between processor1210 and devices, such as the graphics card 1250. The input/output hub1220 may be coupled to the processor 1210 via various interfaces. Forexample, the interface between the processor 1210 and the input/outputhub 1220 may be a front side bus (FSB), a system bus, a HyperTransport,a lightning data transport (LDT), a QuickPath interconnect (QPI), acommon system interface (CSI), etc. Although FIG. 17 illustrates thecomputing system 1200 including one input/output hub 1220, in someembodiments, the computing system 1200 may include a plurality ofinput/output hubs. The input/output hub 1220 may provide variousinterfaces with the devices. For example, the input/output hub 1220 mayprovide an accelerated graphics port (AGP) interface, a peripheralcomponent interface-express (PCIe), a communications streamingarchitecture (CSA) interface, etc.

The graphics card 1250 may be coupled to the input/output hub 1220 viaAGP or PCIe. The graphics card 1250 may control a display device (notshown) for displaying an image. The graphics card 1250 may include aninternal processor for processing image data and an internal memorydevice. In some embodiments, the input/output hub 1220 may include aninternal graphics device along with or instead of the graphics card 1250outside the graphics card 1250. The graphics device included in theinput/output hub 1220 may be referred to as integrated graphics.Further, the input/output hub 1220 including the internal memorycontroller and the internal graphics device may be referred to as agraphics and memory controller hub (GMCH).

The input/output controller hub 1230 may perform data buffering andinterface arbitration to efficiently operate various system interfaces.The input/output controller hub 1230 may be coupled to the input/outputhub 1220 via an internal bus, such as a direct media interface (DMI), ahub interface, an enterprise Southbridge interface (ESI), PCIe, etc. Theinput/output controller hub 1230 may provide various interfaces withperipheral devices. For example, the input/output controller hub 1230may provide a universal serial bus (USB) port, a serial advancedtechnology attachment (SATA) port, a general purpose input/output(GPIO), a low pin count (LPC) bus, a serial peripheral interface (SPI),PCI, PCIe, etc.

In some embodiments, the processor 1210, the input/output hub 1220 andthe input/output controller hub 1230 may be implemented as separatechipsets or separate integrated circuits. In other embodiments, at leasttwo of the processor 1210, the input/output hub 1220 and theinput/output controller hub 1230 may be implemented as a single chipset.

The present inventive concept may be applied to any memory device thatrequires a repair control circuit to control a repair operation and to asystem including the memory device. The present inventive concept may beapplied to systems such as be a mobile phone, a smart phone, a personaldigital assistant (PDA), a portable multimedia player (PMP), a digitalcamera, a music player, a portable game console, a navigation system,etc.

Example embodiments have been disclosed herein, and although specificterms are employed, they are used and are to be interpreted in a genericand descriptive sense only and not for purpose of limitation. In someinstances, as would be apparent to one of ordinary skill in the art asof the filing of the present application, features, characteristics,and/or elements described in connection with a particular embodiment maybe used singly or in combination with features, characteristics, and/orelements described in connection with other embodiments unless otherwisespecifically indicated. Accordingly, it will be understood by those ofskill in the art that various changes in form and details may be madewithout departing from the spirit and scope of the present invention asset forth in the following claims.

What is claimed is:
 1. A repair control circuit controlling a repairoperation of a semiconductor memory device, the repair control circuitcomprising: a row matching block configured to store fail groupinformation indicating one or more fail row groups among a plurality ofrow groups, the row groups being determined by grouping a plurality ofrow addresses corresponding to a plurality of wordlines, each of thefail row groups including one or more fail row addresses of fail memorycells, the row matching block configured to generate a group matchsignal based on input row address and the fail group information,wherein the group match signal indicates the fail row group includingthe input row address; and a column matching block configured to storefail column addresses of the fail memory cells, and configured togenerate a repair control signal based on input column address, thegroup match signal, and the fail column addresses, wherein the repaircontrol signal indicates whether the repair operation is to be executedor not.
 2. The repair control circuit as claimed in claim 1, wherein therow matching block stores fail group addresses as the fail groupinformation, the fail group addresses indicating the fail row groups, abit number of each fail group address being smaller than a bit number ofeach fail row address.
 3. The repair control circuit as claimed in claim2, wherein the fail group addresses are hashing values converted fromthe fail row addresses using a hashing function.
 4. The repair controlcircuit as claimed in claim 2, wherein the fail group addresses aredetermined by grouping remainders of the fail row addresses when dividedby a reference value, a memory cell array of the semiconductor memorydevice including a plurality of sub arrays, the reference valuecorresponding to a number of wordlines in each sub array.
 5. The repaircontrol circuit as claimed in claim 4, wherein a number of wordlines ina first row group at an edge portion of each sub array is smaller than anumber of wordlines in a second row group at a center portion of eachsub array.
 6. The repair control circuit as claimed in claim 2, whereinthe row matching block includes: a group address storage configured tostore the fail group addresses; an address convertor configured toconvert the input row address into an input group address indicating therow group including the input row address; and a group comparatorconfigured to compare the input group address with the fail groupaddresses to generate the group match signal.
 7. The repair controlcircuit as claimed in claim 1, wherein the row matching block storesgroup bits as the fail group information, the group bits respectivelycorresponding to the row groups, each group bit having a first logicvalue when the corresponding row group is the fail row group and asecond logic value when the corresponding row group is not the fail rowgroup.
 8. The repair control circuit as claimed in claim 7, wherein therow matching block includes: a bloom filter table configured to storethe group bits; an address convertor configured to convert the input rowaddress to an input group address indicating the row group including theinput row address; and a signal generator configured to extract thelogic value of the group bit corresponding to the input group addressfrom the bloom filter table and to generate the group match signal. 9.The repair control circuit as claimed in claim 1, wherein the columnmatching block includes: a column address storage configured to storethe fail column addresses, and configured to output the fail columnaddresses corresponding to the fail row group including the input rowaddress in response to the group match signal; and a column comparatorconfigured to compare the input column address with the fail columnaddresses output from the column address storage to generate the repaircontrol signal.
 10. The repair control circuit as claimed in claim 9,wherein: the column address storage includes a plurality of storageunits for storing the one or more fail column addresses with respect toeach fail row group, and the repair control signal includes a pluralityof bit signals indicating a column address of the redundancy memory cellfor replacing the fail memory cell corresponding to the input rowaddress and the input column address, and indicating whether the repairoperation is to be executed or not.
 11. A semiconductor memory device,comprising: a memory cell array including a plurality of memory cellscoupled to a plurality of wordlines and a plurality of normal bitlines,respectively, and a plurality of redundancy memory cells coupled to theplurality of wordlines and a plurality of redundancy bitlines; a rowselection circuit configured to select one of the wordlines based on aninput row address; a column selection circuit configured to select oneof the normal bitlines based on an input column address in a normaloperation and configured to select one of the redundancy bitlines basedon a repair control signal in a repair operation; and a repair controlcircuit configured to store fail group information and fail columnaddresses of fail memory cells, the fail group information indicatingone or more fail row groups among a plurality of row groups, the rowgroups being determined by grouping a plurality of row addressescorresponding to the plurality of wordlines, each of the fail row groupsincluding one or more fail row addresses of the fail memory cells, therepair control circuit configured to generate the repair control signalbased on the input row address, the input column address, the fail groupinformation, and the fail column addresses.
 12. The semiconductor memorydevice as claimed in claim 11, wherein the repair control circuitincludes: a row matching block configured to store the fail groupinformation and configured to generate a group match signal based on theinput row address and the fail group information, wherein the groupmatch signal indicates whether the row group including the input rowaddress is the fail row group or not; and a column matching blockconfigured to store the fail column addresses and configured to generatethe repair control signal based on the input column address, the groupmatch signal and the fail column addresses, wherein the repair controlsignal indicates whether the repair operation is to be executed or not.13. The semiconductor memory device as claimed in claim 12, wherein therow matching unit includes: a group address storage configured to storefail group addresses as the fail group information, the fail groupaddresses indicating the fail row groups, a bit number of each failgroup address being smaller than a bit number of each fail row address.14. The semiconductor memory device as claimed in claim 12, wherein therow matching block includes: a bloom filter table configured to storegroup bits as the fail group information, the group bits respectivelycorresponding to the row groups, each group bit having a first logicvalue when the corresponding row group is the fail row group and asecond logic value when the corresponding row group is not the fail rowgroup.
 15. The semiconductor memory device as claimed in claim 12,wherein the row matching block includes: an address convertor configuredto convert the input row address to an input group address indicatingthe row group including the input row address.
 16. The semiconductormemory device as claimed in claim 11, further comprising: a non-volatilememory configured to store the fail group information and the failcolumn addresses, wherein the fail group information and the fail columnaddresses in the non-volatile memory are loaded to a volatile memoryincluded in the repair control circuit during an initializing process ofthe semiconductor memory device.
 17. The semiconductor memory device asclaimed in claim 11, wherein first memory cells and second memory cellsare replaced with redundancy memory cells coupled to a same redundancybitline, where the first memory cells and second memory cells arecoupled to different normal bitlines and included in different rowgroups.
 18. A repair control circuit controlling a repair operation of asemiconductor memory device, the repair control circuit comprising: amemory configured to store fail group information and fail columnaddresses of fail memory cells, the fail group information indicatingone or more fail row groups among a plurality of row groups; an addressconvertor configured to group a plurality of row addresses correspondingto a plurality of wordlines into the plurality of row groups, each ofthe fail row groups including one or more fail row addresses of the failmemory cells; and a comparison unit configured to generate the repaircontrol signal based on an input row address, an input column address,the fail group information, and the fail column addresses.
 19. Therepair control circuit as claimed in claim 18, wherein the fail groupaddresses are determined by grouping remainders of the fail rowaddresses when divided by a reference value, a memory cell array of thesemiconductor memory device including a plurality of sub arrays, thereference value corresponding to a number of wordlines in each subarray.
 20. The repair control circuit as claimed in claim 19, wherein anumber of wordlines in a first row group at an edge portion of each subarray is smaller than a number of wordlines of a second row group at acenter portion of each sub array.